| ITEM |
mil |
mm |
| TRACES/SPACES |
| Minimum Trace Width/Space (Inner) |
3.0/3.0 |
0.076/0.076 |
| Minimum Trace Width/Space (External) |
3.0/3.0 |
0.076/0.076 |
| Minimum SMT Pitch |
2.5 |
0.064 |
| Minimum BGA Pitch |
4 |
0.1 |
| DRILL |
| Minimum Drill Size For Through Hole (Mechanical Drill) |
7.8 |
0.2 |
| Minimum Drill Size For Through Hole (Laser Drill) |
3 |
0.076 |
| Aspect Ratio (Mechanical Drill) |
12:1 |
| PRE-PREG LAMINATE |
| Minimum Board Overall Thickness for 4 - Layer |
10 |
0.254 |
| 6 - Layer |
15 |
0.38 |
| 8 - Layer |
19 |
0.48 |
| 10 - Layer |
15 |
0.6 |
| Minimum Thin Core Thickness |
2 |
0.051 |
| Maximum Overall Thickness for 4-16 Layer |
250 |
6.35 |
| Maximum Working Panel Size |
21" x 24" |
533.4 x 609.6 |
| Maximum Layer Count |
36 Layers |
| SOLDER MASK |
| Registration Tolerance: Layer to layer |
4 |
0.1 |
| Solder mask |
2 |
0.051 |
| CONTROLLED IMPEDANCE |
| Controlled Impedance |
40-120W ± 10% |
| Diff. Controlled Impedance |
75-120W ± 10% |
| SURFACE FINISH |
| Lead Solder (HASL) |
OSP (Entek) |
| Lead Free Solder (HASL) |
Carbon Ink |
| Immersion Tin |
Peelable Mask |
| Immersion Silver |
Deep / Hard Gold |
| Immersion Gold |
Wirebondable Gold |
| MATERIAL OFFERING |
| FR-4 (140 C Tg) |
Gentek |
| FR-5 (170 C Tg) |
Nelco |
| Aluminum |
Polyimide |
| Arlon |
Rogers 4350 |
| E-Test |
UNIT |
PROCESS CAPABILITY |
| Flying Probe Tester |
/ |
max 19.6" x 23.5" |
| Min Spacing From Test Pad to Board Edge |
mm |
0.5 |
| Min Conductive Resistance |
Ω |
10 |
| Max Insulation Resistance |
MΩ |
100 |
| Max Test Voltage |
V |
500 |
| Min Test Pad Diameter |
mil |
3.9 |
| Min Test Pad to Pad Spacing |
mil |
3.9 |
| Max Test Current |
mA |
200 |
