1. Fill out the PCB International automated online quote engine with your custom specs specs. Check out and order in minutes.

2. Email us at support@pcbinternational.com  with your Gerber file and desired quantities/lead times. Quotes will be provided generally in 1 hour or less during business hours.

3. Ask about our quick-turn specials today! 2 layer (2 days), 4 layer (3 days)

 
 
Capabilities - Rigid Circuit Flex capabilities

ITEM mil mm
TRACES/SPACES
Minimum Trace Width/Space (Inner) 3.0/3.0 0.076/0.076
Minimum Trace Width/Space (External) 3.0/3.0 0.076/0.076
Minimum SMT Pitch 2.5 0.064
Minimum BGA Pitch 4 0.1
DRILL
Minimum Drill Size For Through Hole (Mechanical Drill) 7.8 0.2
Minimum Drill Size For Through Hole (Laser Drill) 3 0.076
Aspect Ratio (Mechanical Drill) 12:1
PRE-PREG LAMINATE
Minimum Board Overall Thickness for 4 - Layer 10 0.254
6 - Layer 15 0.38
8 - Layer 19 0.48
10 - Layer 15 0.6
Minimum Thin Core Thickness 2 0.051
Maximum Overall Thickness for 4-16 Layer 250 6.35
Maximum Working Panel Size 21" x 24" 533.4 x 609.6
Maximum Layer Count 36 Layers
SOLDER MASK
Registration Tolerance: Layer to layer 4 0.1
Solder mask 2 0.051
CONTROLLED IMPEDANCE
Controlled Impedance 40-120W ± 10%
Diff. Controlled Impedance 75-120W ± 10%
SURFACE FINISH
Lead Solder (HASL) OSP (Entek)
Lead Free Solder (HASL) Carbon Ink
Immersion Tin Peelable Mask
Immersion Silver Deep / Hard Gold
Immersion Gold Wirebondable Gold
MATERIAL OFFERING
FR-4 (140 C Tg) Gentek
FR-5 (170 C Tg) Nelco
Aluminum Polyimide
Arlon Rogers 4350
E-Test UNIT PROCESS CAPABILITY
Flying Probe Tester / max 19.6" x 23.5"
Min Spacing From Test Pad to Board Edge mm 0.5
Min Conductive Resistance Ω 10
Max Insulation Resistance 100
Max Test Voltage V 500
Min Test Pad Diameter mil 3.9
Min Test Pad to Pad Spacing mil 3.9
Max Test Current mA 200
     
     
HOME    |    ABOUT US    |    CAPABILITIES    |    SHIPPING    |    HOW TO ORDER    |    FAQ    |    CONTACT
 
Copyright © 2013 PCB INTERNATIONAL. All Rights Reserved.