Assembly Quote and Order

Please combine the following files into a single ZIP file and contact us at for a quick and non-obligatory quotation:

1. PCB Design File. Please include all Gerbers (at minimum we require copper layer(s), solder paste layers, and silkscreen layers). 2. Pick and Place (Centroid). Information should include component location, rotations, and reference designators. 3. Bill Of Materials (BOM). Information provided must be in machine readable format (Excel or CVS). Your BOM should include:

  • Quantity of each part
  • Reference designator
  • Vendor and/or MFG Part Number (Digi-Key, Mouser, etc.)
  • Part description
  • Package description (QFN32, SOIC, 0805, etc. package is very helpful but not required).
  • Type (SMT, Thru-Hole, Fine-pitch, BGA, etc.).

PCB International offers a single-source approach to full turnkey (or partial turnkey) assembly services

With full turnkey assembly, we handle all aspects of the assembly project: sourcing materials and components, manufacturing printed circuit boards, coordinating logistics with assembly house (lead times, shipping, potential overages/substitutions), quality control, and delivery of final product to customer. It's a lot to take on, which is why it's the preferred method for most of our customers.

Partial turnkey allows customers to take control of one or more processes listed above. Most often for partial turnkey services, the customer ships us the components through consignment (or partial consignment if not all components are supplied) and we take care of the rest.

Our capabilities range from quick turn prototypes to high volume production with highly automated processes that help us provide more efficient services by eliminating the bottleneck of dealing with multiple suppliers. You can now source components, manufacture bare boards, and assemble your product under one roof. Get started with a quotation and order by following the instructions below.

We offers the highest quality printed circuit boards at the most competitive pricing. Whether you need a few quick turn PCB prototypes or mass production, our world class manufacturing can meet your specialized pcb needs.

Combining years of experience with the latest in high-tech manufacturing efficiencies allow our pricing to be among the most competitive. Our boards are manufactured based on IPC guidelines and comply with ISO-9001-2000, UL, and RoHS standards.

Try our on-line PCB Quote for real-time quoting and ordering (no email required).



  • Automatic placement of CBGA, PBGA, MBGA Verification of BGA's using real-time x-ray system.
  • Removing & Replacing BGA's & MBGA's, Experienced with Ceramic & Plastic BGA's, Reballing BGA's & MBGA.


  • Ball Grid Array (BGA)
  • Ultra-Fine Ball Grid Array (uBGA)
  • Quad Flat Pack No-Lead (QFN)
  • Quad Flat Package (QFP)
  • Plastic Leaded Chip Carrier (PLCC) 6. SOIC, Package-On-Package (PoP)
  • Small Chip Packages (Pitch of 0.2 mm)

Through-Hole Assembly

  • Automated Through-Hole Assembly
  • Manual Through-Hole Assembly
  • Through-hole mounting techniques are now usually reserved for bulkier or heavier components such as electrolytic capacitors or electromechanical relays that require great strength in support


  • Mixed Assembly - Through-Hole, SMT and BGA components are housed on the PCB. Single- or double-sided mixed technology or SMT (Surface Mount) for PCB assembly. Single- or double-sided BGA and micro-BGA installation and rework with 100% X-ray inspection
A note on RoHS: PCB International is committed to helping our customers achieve RoHS standards by implementing lead-free PCB assembly technologies. We offer RoHS options for just about every project. During the assembly process, we also review the Bill of Materials (BOM) for lead containing components and can offer substitutes in cases where RoHS standards are not met. We encourage our customers to choose RoHS options when possible and we'll be there to re-engineer your PCB assemblies and products when you're ready to make the switch.
Item Capabilties
Turn Times 1-4 Weeks (check in for rapid turn around prototyping)
Quantity Prototype to Production
Assembly Type Surface Mount, Through Hole, Mixed
PCB Specifications Rigid, Metal Core, Flex
Max Panel (500 mm x 450 mm)
Component Types SMT 0201 or larger
BGA .5 mm pitch
BGA X-ray inspected
Cable and Wire
SMT Parts Presentation Cut Type, Partial Reel, Bulk, Reel, Tube, Tray
Solder Types Lead Free, RoHS Compliant
Stencils Laser Cut
Quality Standards IPC Class II / IPC Class III